UA315 - United Atoms Impedance Meter, Documentation, Schematics, Code, Issues
Schematics DCH file is in Diptrace format
UA315 - United Atoms Impedance Meter (parked open source hardware project. 2015)
Home Page: http://www.eevblog.com/forum/oshw/oshw-lcresr-impedance-meter-diy-benchtop-kit-ua315/
License: MIT License
For next iteration of stencil use guiding coaxial holes for square "nail guides".
Silk screen must include URL, version, Pb-free symbol and other symbols.
Also may be copyright, year, logo
Solder mask is too crude to 0.5 and 0.4 mm pitch.
Software clocking details for UTFT, fuses changes for Atmel, voltage 3.4V must be documented.
UTFT board up-converter dies when powered without LED connected.
To resolve the issue, the next iteration should include 30V zener to limit output voltage in no-load situation.
LOW PRIORITY
Consider adding epoxy filled variation of UTFT with custom gasket
This may be not environmentally friendly, ruggedized, high cost option for demanding applications
Consider testing UTFT board for FCC compliance
This "LOW PRIORITY issue"
Study, how come the board has survived inverted DC power polarity mistake.
The DC was 5V limited to 160mA. The duration was about 0.5 sec.
0603 capacitor are mismatching expected 0805 footprints. All filter 0.1uF capacitors must be replaced with 0805 ones.
6-pin ISP connector is located too close to main 34P connector. It needs to be moved 7-10 mm from current location.
Add white block area to silk screen to mark the manufacturing date and serial numbers by hand.
Replace square plastic spacers and plain screws with steel matte wide head (flat) screws
Board is exactly 1.6mm thick, better to reduce the board thickness if possible. To improve mechanical tolerances, reduce the board thickness to 1mm or less. Check if 4 layers boards exist for this thicknesses.
Hand soldering thermal profile is too high >200C. There is need to use automated oven with 160C-170C MAX in profile to avoid scorching of white plastic 40P component.
LOW PRIORITY
Consider using ARM based arduino chip.
Add the 7-15 mil wide insulation tape to back side of UTFT board, covering all the traces completely
Add 4 notches in board outline to match the extruded plastic part.
Up-converter inductor is too close to board's edge. Same with capacitors.This makes the panel hole cutting dimensions unnecessarily too accurate. All needs to be moved 3-5 mm closer to center of the board. Also large 40P connector is too close to the edge.
Inductor pads on digital board should be larger for more solder. Or may be preheating needs to be longer for inductor to heat up for better solder wetting
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