Delivery of the ISSDK in Pack format about nxp_sensor_sdk HOT 3 OPEN

BSP should provide boards information.

Correct.

Note that the examples currently only use the Device Family Packs (DFPs) and not yet the BSPs. This is manifested in the csolution.yml files where "device" is specified instead of "board" and also in the cproject.yml files where the component ":NXP::Board Support:SDK Project Template:project_template" device variant from DFP is specified instead of the board variant from BSP. This still needs to be updated.

Would Shield folder be another BSP, or included in an ISSDK pack? Forward looking, would think Shield would be a BSP itself?

Looking just at the pack mechanics, any pack can be used. However for Devices, DFPs should be used and for Boards, BSPs should be used.

CMSIS-Pack has specific provisions for "device" and "board" (no specific provisions for shields).

Shields are actually boards, so it makes sense that the Shield folder is provided in a BSP. Each Shield could be in its own BSP in order to separate and update the packs independently. However, Shield folders contain only a header and layer description. Having all sensor shields in one BSP could also be an option.

It is left to the provider to decide what fits better looking from the pack development and maintaining the packs.

ISSDK delivered as a pack would include:

• middleware files
• examples: Boards and Shields are only referenced as layers in the cproject.yml (no direct references to the Board/Shield files other then layer description). The layers are described in BSPs.

"pdsc" would describe the middleware files as components and example csolution.

Then IDE tool loads MSP and sees middleware and Examples.

Correct.

from nxp_sensor_sdk.

A quick follow-up on where the Shield folder could be.

Eventually it can be also in the MSP pack together with ISSDK. The sensor drivers are already part of the ISSDK. Therefore, adding the Shields to the same pack also makes sense.

There are various options, and the pack provider can decide what is the best fit.

from nxp_sensor_sdk.

We should consider providing CMSIS packs for devices, boards and add-on boards (like shield boards). Not sure whether including shield boards in "boards" BSP would make sense. Adding shield board to MSP pack could make sense as well but then there should be a way to select which shield board user want while adding ISSDK MSP pack. Ideally we should have add-on board or extension board BSP and supporting Middleware MSP.

from nxp_sensor_sdk.