Backplane RevB updates about signpost HOT 14 CLOSED

• I2C bypass jumpers in case the isolators aren't working
  • more evidence indicates that was really only a problem of the rush solder job on the first round

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• Large annular rings around all mechanical holes!
• Don't route any traces near mechanical holes

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• All traces on middle layers?
  • From below, not doing this for now. Moved all traces away from the edges and from mount holes where possible

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• A generally thicker, more sturdy pcb

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If the PCB gets thicker, we have to keep in mind the through-hole parts and make sure they are still solderable.

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• replace GPIO extender package with version from debug backplane

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• Add GPIO extender to reset / monitor the USB hub

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• Validate all component heights are < 0.080" (for compat w/ thicker pcb)
  • tallest component is the big USB cap, coming in at 0.075"

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All traces on middle layers?

Where are we at on this - superfluous or worth the effort? I kinda don't want to do it just because it'll take a while to do, but if it's worth it I will

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I think it's unnecessary

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I think I've now addressed everything here.

Do we have other changes or additions to the backplane?

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• Connect the watchdog from controller to power module
  • @brghena update controller module in library to add watchdog pin
  • @nealjack update power module in library to add watchdog pin

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• Step up the vbat+/- and vsol+- traces to at least 100mil

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